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Please use this identifier to cite or link to this item: http://hdl.handle.net/1860/3184

Title: Characterization of chemical-mechanical planarization Pads with X-Ray microtomography and finite element modeling
Authors: Sexton, Michael John
Keywords: Materials engineering;Chemical mechanical planarization;Porous materials -- Mechanical properties
Issue Date: 20-Jan-2010
Abstract: Modeling the mechanical behavior of realistic porous structures with finite element models generated from x-ray tomography scan data has been a recent interest for various fields including metallic foams [1], bone and biomedical scaffolds [2], and even bread [3]. This work studies the feasibility of using x-ray micro-computed tomography (μCT) and finite element analysis (FEA) to model the structural deformation and mechanical properties of Chemical-Mechanical Planarization (CMP) pads in compression. The electronics industry uses CMP pads to polish and flatten the surface of integrated circuit chip die wafers in between steps of the lithography process. Non-uniformity of material removal impairs the performance of CMP pads. This is believed to be in part due to the internal porosity of the pad and its interaction with the abrasive slurry. In-situ μCT compression experiments were carried out to map the structural deformation of internal porosity and measure its effect on the global and local stress-strain behavior of CMP pads. Scan data of unloaded samples were used to develop finite element simulations of the material. The reported results of experiments and simulations exhibit the strength of μCT and FEA as characterization techniques for CMP pads. This work provides insight into the compressive behavior of the pad material and the response of the actual structure. This work may also serve as a foundation for a more complete study of the CMP process and materials.
URI: http://hdl.handle.net/1860/3184
Appears in Collections:Drexel Theses and Dissertations

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